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GaAs INTEGRATED CIRCUIT
PG2250T5N
1.8 V, POWER AMPLIFIER FOR BluetoothTM Class 1
DESCRIPTION
The PG2250T5N is a GaAs MMIC for power amplifier which was developed for Bluetooth Class 1. This device realizes high efficiency, high gain and high output power. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able to high-density surface mounting.
FEATURES
* Operating frequency * Supply voltage * Control voltage * Circuit current * Output power * Gain control range * High efficiency : fopt = 2 400 to 2 500 MHz (2 450 MHz TYP.) : VDD1, 2, 3 = 1.5 to 3.5 V (1.8 V TYP.) : Vcont = 1.5 to 2.1 V (1.8 V TYP.) : IDD = 100 mA TYP. @ VDD1, 2, 3 = 1.8 V, Vcont = 1.8 V, Pout = +19 dBm : Pout = +20.0 dBm TYP. @ VDD1, 2, 3 = 1.8 V, Vcont = 1.8 V, Pin = -5 dBm : GCR = 60 dB TYP. @ VDD1, 2, 3 = 1.8 V, Vcont = 0 to 1.8 V, Pin = -5 dBm : PAE = 55% TYP. @ VDD1, 2, 3 = 1.8 V, Vcont = 1.8 V, Pin = -5 dBm
* High-density surface mounting : 6-pin plastic TSON package (1.5 x 1.5 x 0.37 mm)
APPLICATION
* Power Amplifier for Bluetooth Class 1
ORDERING INFORMATION
Part Number Order Number Package 6-pin plastic TSON (Pb-Free) Marking G5C Supplying Form * Embossed tape 8 mm wide * Pin 1, 6 face the perforation side of the tape * Qty 3 kpcs/reel
PG2250T5N-E2
PG2250T5N-E2-A
Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PG2250T5N-A
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PG10639EJ01V0DS (1st edition) Date Published September 2006 NS CP(K)
2006
PG2250T5N
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View) (Top View) (Bottom View)
Pin No. 1 Pin Name OUTPUT/VDD3 N.C. Vcont INPUT VDD1 VDD2
1
6
1
6
6
1
2 3
G5C
Parameter Parameter
2
5
2
5
5
2
4 5 6
3
4
3
Bias Circuit
4
4
3
Remark Exposed pad : GND
ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified)
Symbol VDD1, 2, 3 Vcont IDD Icont Pin PD TA Tstg Ratings 5.0 2.4 250 5 +5 400
Note
Unit V V mA mA dBm mW C C
Supply Voltage Control Voltage Circuit Current Control Current Input Power Power Dissipation Operating Ambient Temperature Storage Temperature
-40 to +85 -55 to +150
Note Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB, TA = +85C
RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified)
Symbol fopt VDD1, 2, 3 Vcont MIN. 2 400 1.5 1.5 TYP. 2 450 1.8 1.8 MAX. 2 500 3.5 2.1 Unit MHz V V
Operating Frequency Supply Voltage Control Voltage
2
Data Sheet PG10639EJ01V0DS
PG2250T5N
ELECTRICAL CHARACTERISTICS (TA = +25C, VDD1, 2, 3 = 1.8 V, f = 2 450 MHz, Pout = +19 dBm, external input and output matching, unless otherwise specified)
Parameter Circuit Current Control Current Shut Down Current Output Power 1 Output Power 2 Gain Control Range Efficiency 2nd Harmonics Symbol IDD Icont Ishut down Pout1 Pout2 GCR PAE 2f0 Test Conditions Vcont = 1.8 V, Pout = +19 dBm Vcont = 1.8 V, Pout = +19 dBm Vcont = 0 V, RF None Vcont = 1.8 V, Pin = -5 dBm Vcont = 0 V, Pin = -5 dBm Vcont = 0 to 1.8 V, Pin = -5 dBm Vcont = 1.8 V, Pin = -5 dBm Vcont = 1.8 V, Pin = -5 dBm MIN. - - - +19.0 - - - - TYP. 100 - - +20.0 -40.0 60 55 35 MAX. 130 3 5 - - - - - Unit mA mA
A
dBm dBm dB % dBc
Data Sheet PG10639EJ01V0DS
3
PG2250T5N
EVALUATION CIRCUIT
VDD3
0.1 F
12 nH
10 pF OUTPUT 1.5 pF 2.2 nH 2 5 1 000 pF 0.1 F VDD1 1 6 0.1 F VDD2
Vcont 0.1 F
3
Bias Circuit
4 5.6 nH
INPUT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
4
Data Sheet PG10639EJ01V0DS
PG2250T5N
TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
Condition : f = 2 450 MHz, VDD1 = VDD2 = VDD3 = Vcont = 1.8 V, with external input and output matching circuits
OUTPUT POWER, GAIN, CIRCUIT CURRENT, EFFICIENCY vs. INPUT POWER
35 140
30 25 20 15 10 5 0 -30 -25
Gain
IDD
120 100
Pout
80 60
PAE
40 20
-20
-15
-10
-5
0
0 5
Input Power Pin (dBm)
Condition : f = 2 450 MHz, VDD1 = VDD2 = VDD3 = Vcont = 1.8 V, Pin = -5 dBm, with external input and output matching circuits
OUTPUT POWER, CIRCUIT CURRENT, EFFICIENCY vs. CONTROL VOLTAGE
30 20 Pout 140 120 100 80 PAE 60 40 20 0 0.5 1 1.5 2 2.5 0 3
10 IDD 0 -10 -20 -30 -40
Control Voltage Vcont (V)
Remark The graphs indicate nominal characteristics.
Circuit Current IDD (mA), Efficiency PAE (%)
Output Power Pout (dBm)
Circuit Current IDD (mA), Efficiency PAE (%)
Output Power Pout (dBm), Gain (dB)
Data Sheet PG10639EJ01V0DS
5
PG2250T5N
Condition : f = 2 450 MHz, VDD1 = VDD2 = VDD3 = Vcont = 1.8 V, with external input and output matching circuits
2ND HARMONICS vs. OUTPUT POWER
0 -10
2nd Harmonics 2f0 (dBc)
-20 -30 -40 -50 -60 -70 5 10 15 20 25
Output Power Pout (dBm)
Condition : VDD1 = VDD2 = VDD3 = Vcont = 1.8 V, with external input and output matching circuits
S11-FREQUENCY
0 -10 -20 -30 -40 m1 -50 -60 -70 m1: f = 2.450 GHz S (1,1) = 0.207/-115.086 impedance = Z0 * (0.786 - j0.307) STOP 5.100 GHz -80 -90
S11, S22-FREQUENCY
m5
m5: f = 2.450 GHz dB (S (1,2)) = -54.402
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Frequency f (GHz)
START 100.0 MHz
S21-FREQUENCY
40
S22-FREQUENCY
m3
30 20 10 0 -10 -20 -30 -40 m7
m3: f = 2.450 GHz dB (S (2,1)) = 30.921
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Frequency f (GHz) START 100.0 MHz
m7: f = 2.450 GHz S (2,2) = 0.486/-164.104 impedance = Z0 * (0.352 - j0.123) STOP 5.100 GHz
Remark The graphs indicate nominal characteristics.
6
Data Sheet PG10639EJ01V0DS
PG2250T5N
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm)
MOUNTING PAD
0.3 0.5 0.3
1.0
0.3 0.2
0.3
SOLDER MASK
0.475 0.25 0.475
0.35 0.55 0.15
0.25
Solder thickness : 0.08 mm
Remark The mounting pad and solder mask layouts in this document are for reference only.
0.5
0.5
0.5
0.5
Data Sheet PG10639EJ01V0DS
7
PG2250T5N
PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm)
(Top View)
1.50.1
(Side View)
(Bottom View)
0.30.07
0.50.06
1.50.1
0.37+0.03 -0.05
0.20.1
0.2+0.07 -0.05
0.70.1
8
Data Sheet PG10639EJ01V0DS
1.20.1
PG2250T5N
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260
For soldering
Preheating temperature (package surface temperature) : 120C or below
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10639EJ01V0DS
9
PG2250T5N
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
* The information in this document is current as of September, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
M8E 02. 11-1
10
Data Sheet PG10639EJ01V0DS
PG2250T5N
Caution
GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: contact@ncsd-hk.necel.com Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/
0604
4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279
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CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
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